Ultra-High Performance Scalable 3-D Microscale Convection Cooling Heat Sink

Patent Number:

Patent Pending

Inventor(s) :

Tao, Yon Xin;

Hao, Yingli;

Moreno, Ryan

For more information, contact:

Dr. Susan Webster, Director

Office of Intellectual Property Management

Phone: 305-348-0008

Email: websters@fiu.edu

This new heat sink, used in conjunction with a micro pump and micro cooler will meet the demand of cooling micro electronic components with ultra-high heat generation technology. Further development and improvement of cost-effective fabrication method will lead to a newer generation of high energy density electronic devices such as laser, high performance computers, and computers, and various electronic control devices in defense applications.

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